• High-precision SMT Lines (ASM Siplace X, Panasonic)
• 3D SPI 3D AOI, 3D X-Ray, FAL, ICT, FCT, Flying Probe Test etc.
• Selective Soldering & Wave soldering
• World class Process Techniques: FOB, Coc, Underfill, Coating, etc.

• Box Build, Module Assembly, Final Assembly, etc.
  Self-developed Automated Assembly Lines (China Intelligent Manufacturing Plot Demonstration Project)
• Class 10 000 Clean Room

• Full Range of Testing Solution Covering All Processes from Manufacturing to Shipping
• Testing Solution Based on Different Customer Need
• OGP, Golden Finger Inspection
• 3D SPI, 2D & 3D AOI,2.5D & 3D X-Ray
• ICT, Flying Probe Test, Functional Test EOL, CCD test
• Three-coordinates measurement, Screen Test, RF Test, Two tone, CMM Test
• Tune and Analogue Test, Dual-signal Test, WIFI, Bluetooth,
• FR test
• Reliability Test (Aging Test, Temperature Cycle Test, Waterproof, Dustproof, Salt Spray Test, etc.)
• Final Test, Visual Inspection
   

• Dedicated Workshop
• IP Protection
• Multi-national Engineering Team for Technical Support
• Jigs & Fixtures Design and Development
• In-house Reliability Test & Failure Analysis & FAI
• Traceability in Component Level (Self-developed MES System)
• DFX Analysis: DFM, DFT, etc. (By Valor).
• ISO9001:2015, ISO14001:2015, OHSAS18001:2007, TS16949:2016 and TL9000
• CIT/CIS Certified Engineers